The reason there is so much interest in so-called Augmented Reality (XR) is that normal reality can become more. This umbrella can include all augmented and virtual reality solutions on the market, but you’re probably aware of existing hardware issues. It’s bulky. At the Snapdragon Summit, Qualcomm unveiled his new Snapdragon AR2 Gen 1 platform. It’s a connected solution that helps OEMs create a new generation of sophisticated augmented reality glasses.
Previously, Qualcomm’s augmented reality work was based on the XR1 and XR2 platforms, but AR devices now have their own reference hardware as a starting point. Snapdragon AR2 Gen 1 is optimized for the unique challenges of AR hardware, including size, power efficiency and performance. AR2 Gen 1 will rely on the same 4nm process node as Qualcomm’s latest flagship smartphone processors. As a result, the AR2 uses 50% less power than the XR2 while offering a 40% smaller PCB. This is important for anything that hangs over the bridge of your nose.
OEMs can choose to use a single-board solution or spread the AR2 Gen 1 components throughout the hardware. For example, you can put the main processor in one temple of your glasses and your connectivity solution (which supports Wi-Fi 7) on the other side. Meanwhile, a co-processor sits in the middle for eye tracking and image processing. In that regard, Qualcomm says AR2 has 2.5 times higher AI performance compared to XR2.
AR2 Gen 1 natively supports Snapdragon Spaces, Qualcomm’s developer platform for XR experiences. I have used some demos developed by Snapdragon Spaces on XR2 based hardware. The technology was impressive, but the hardware was clunky and ruined the experience. AR2 Gen 1 could be a big help in applications that don’t need the power of XR2. According to Qualcomm, OEMs like Lenovo, OnePlus, Motorola and Xiaomi are already developing products with AR2 Gen 1. However, it doesn’t provide any estimates as to when consumers will be able to see the first devices based on his AR2 Gen 1.
Qualcomm didn’t just stop at AR. AR has even more new chips. The Snapdragon S3 Gen 2 and S5 Gen 2 are the most advanced Bluetooth audio platform the company has ever made, offering a new personal audio experience. The S5 and S3 promise support for lossless audio with even lower latency than before, at just 48ms for Bluetooth LE audio. Qualcomm has also worked with the Bluetooth SIG to ensure the chip works with his latest LE features such as Audacast, which broadcasts high-quality audio for multiple devices to participate.
Based on Qualcomm’s consumer research, interest in spatial audio is growing, and its new platform supports it with dynamic head tracking. And with Qualcomm’s new Adaptive Active Noise Cancellation, sound isolation is enhanced. This takes into account not only environmental noise, but also how earphones and headphones fit the user.
In this case, Qualcomm has given a general timeline for availability, but it won’t happen anytime soon. No new earbuds or headphones with it will be available until late 2023.
