according to Korea Herald, Samsung just hired a high-ranking top TSMC employee, namely Lin Jun-cheng. He worked for a Taiwanese company for about 19 years, and before that he worked for Micron Technology. That’s some serious background.
Lin Jun-cheng will lead Samsung’s Advanced Packaging Team, part of the Device Solutions Division, and play an integral role in chip development. He was involved in developing his 3D packaging technology for TSMC, so this could be a big hit for the South Korean tech giant.
Samsung’s Exynos chipset for smartphones is very capable but often criticized. Qualcomm’s chips are often more powerful overall thanks to their Adreno GPUs, while TSMC’s manufacturing process is arguably more efficient. So it’s been long overdue to see this year’s Galaxy S series come in a single Snapdragon variant.
The latest hires suggest Samsung is restructuring and will soon make another attempt. If Lin Jun-cheng can turn things around, he could win coveted customers like Apple and Qualcomm.
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