Silicon interposer, 8 HBM3 stacks, and 4 sets of GPU or CPU tiles
Serve The Home did their best to capture a live event featuring Dr. Lisa Su unveiling AMD’s new Instinct MI300 AI chip. As the title says, the design is unique to AMD, featuring his chunky 153B transistor chip with his new HBM3. The 192 GB HBM3 is paired with a CDNA3 GPU IP block or an AMD Zen 4 CPU IP block, communicating over an 896 GB/s Infinity Fabric connection with 5.2 TB/s of memory bandwidth. This huge amount of memory and bandwidth should reduce the amount of GPU stack used to perform the same tasks as the product AMD is trying to compete with, his NVIDIA’s H100.
Next-gen Instinct will feature a model with 3 GPU tiles and 1 CPU tile, offering more flexibility than this generation of pure GPU or CPU chips. Of course, multiple Instinct MI300s can be chained together to provide both. AMD also announced that the new Instinct MI300 will support CXL Type-3, which was previously unsupported.
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